Marking on semiconductor wafer using LASER is non-contacting dry process and this method has many advantages such as microfabrication, delicate, indelible, clean and flexible. LASER MARKING contributes stable traceability and high-efficiency for automation of production process.
It is applicable not only Si and GaAs wafer, but also new generation material such as SiC and GaN by model SL473DT2 equipped UV laser.
- New model for new generation material (DT2)
- Basic model for Low-volume processing (DS2)
- High Throughput model for high-volume processing (FS4)
- 12inch model (GS3)