Laser marking system for semiconductor wafers.
Marking product names, lot numbers, control numbers, etc. on the front or reverse-side（※1) of wafer surface.
（※1）OPTION: reverse-side marking
It is applicable not only Si and GaAs wafer, but also new generation material such as SiC and GaN by model SL473DT2 equipped UV laser.
System Line-up:
- New model for new generation material (DT2)
- Basic model for Low-volume processing (DS2)
- High Throughput model for high-volume processing (FS4)
- 12inch model (GS3)
SL473DT2 (4,5,6 inch)
OPTION
- 3,8inch
- multiple size
SL473DS2 (4,5,6 inch)
OPTION
- 3,8inch
- multiple size
SL473FS4 (5,6,8 inch)
OPTION
- 4 inch
- multiple size
- 4 carriers
SL473GS3 (12 inch)
Special & Advantage
Realizing stable & high quality marking and long term maintenance free by air cooling type LD pumped laser and laser output automatic correction function.
High system extensibility of option function such as marking checking function by Wafer-ID reader(※1),
Online communication software（※1） & others.
※1=OPTION
Feature 1: Easy operation
- Easy operation by user-friendly 15 inch LCD touch panel
- Flexible wafer-size changing function by recipe changes (※１)
Feature 2: Saving history
- Production record, Error record, Communication records are saved in log file.
Feature 3: Various Applicable marking
- Switchable front-side/Reverse-side marking (※１)
- Soft marking
- Hard marking (※１)
- Marking on GaAs wafer (※１)
- Marking on SiC, GaN wafer (SL473DT2)
※１=OPTION
Soft Marking 
SiC 
GaN
Specification
| Items | SL473DT2 | SL473DS2 | SL473FS4 | SL473GS3 |
| Laser Type | Nd:YLF laser（THG） λ=349nm |
Nd:YLF laser（SHG） λ=523nm | ||
| Character Font | SEMI-OCR （Dot, Engraving） , OCR-B （Engraving） | |||
| Marking Target | Wafer surface observe-side (Option: Reverse-side, Both-side) | |||
| Throughput（※１） | 70pcs/h | 70pcs/h | 240pcs/h | 140pcs/h |
| Available numbers of Carrier | 1 | 1 | 2 （Option: 4） | 1 （Option: 2） |
| Wafer Size | 4, 5, 6 inch （Option: 3, 8 inch, multiple size） |
5, 6, 8 inch （Option: 4 inch, multiple size） |
12 inch | |
| Input power supply required | AC200V±20V, 15A , Single phase, 50/60Hz | AC200V±20V, 20A, Single phase, 50/60Hz | ||
| Vacuum utility | -77±10kPa, 0.01㎥/min | |||
| Compressed air utility | More than 490kPa, 0.01㎥/min | N/A | More than 490kPa, 0.01㎥/min | |
| Other major option | Online communication software, Dust collection unit, Wafer ID reader, others | |||
| Dimension（※２） [mm] |
Approx. 1,100(W)×1,200(D)×1,500(H) | Approx. 1,220(W)× 1,100(D)× 1,455(H) |
Approx. 1,640(W)× 1,690(D)× 1,550(H) |
|
| Main unit Weight | Approx. 600kg | Approx. 630kg | Approx. 900kg | |
（※1)Marking condition: Character size 1.6mm, 12 Characters, 5×9 dots, one shot
（※2）Projection portion is not included.